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Flexible PCB(仕様) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Nov 26, 2025～Dec 23, 2025
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Flexible PCB Product List

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Flexible printed circuit (FPC) low cost

Flexible printed circuit (FPC) low cost

We have a wealth of experience in custom and OEM projects.

■Features Flexible printed circuit boards (FPC boards) excel in flexibility and thinness, maintaining their electrical properties even when bent. The materials used for flexible printed circuit boards (FPC boards) include polyimide, known as coverlay, as an insulator, solder resist, and copper as the conductor. The basic structure of flexible printed circuit boards (FPC boards) consists of a film-like insulator with an adhesive layer formed on top, followed by a layer of conductor foil. The insulator covers and protects all areas except for the terminal and soldering sections. Produced in China, they are low-cost and ideal for value-added proposals. ■Specifications Base material thickness, copper foil thickness, copper foil type, coverlay color, resist color, and surface treatment will be manufactured according to customer specifications.

  • Other industrial robots
  • Notebook PC

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Ultra-fine circuit high-frequency flexible substrate

Ultra-fine circuit high-frequency flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

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  • Wiring materials

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High-frequency compatible flexible substrate (MPI specification)

High-frequency compatible flexible substrate (MPI specification)

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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  • Other electronic parts

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Single-sided flexible printed circuit board (single-sided FPC)

Single-sided flexible printed circuit board (single-sided FPC)

The most standard specifications at a low cost.

This is the most basic structure of an FPC with a conductor pattern formed only on one side.

  • Printed Circuit Board

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Narrow pitch pad on beer flexible substrate

Narrow pitch pad on beer flexible substrate

By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

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  • High frequency/microwave parts

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Flexible circuit board

Flexible circuit board

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide small quantities. They are used in a wide variety of electronic and precision devices, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided / Double-sided ■ Board thickness: Base thickness 25μm / 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Shielded Flexible Printed Circuit Board (Shielded FPC)

Shielded Flexible Printed Circuit Board (Shielded FPC)

Noise countermeasure structure

This is an FPC with a shield structure that is effective for noise countermeasures.

  • Printed Circuit Board

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Single-sided/Dual-sided flexible circuit board

Single-sided/Dual-sided flexible circuit board

By applying a reinforcement plate, component mounting is also possible! It is often used as a substitute for FFC.

We would like to introduce the "Single-Sided/Dual-Sided Flexible Printed Circuit Boards" handled by Matsuwa Sangyo Co., Ltd. The single-sided (1 layer) type is a common specification for flexible printed circuit boards and is often used as a substitute for FFC. There are types with and without an adhesive layer between the base material and copper foil, and we can accommodate both at our company. The dual-sided (2 layers) type allows for more flexible wiring by incorporating through-holes (TH) into the flexible printed circuit board. Please feel free to consult us about multilayer flexible printed circuit boards with three layers or more. 【Shortest Delivery Record Examples】 ■ 1 layer ⇒ Shortest 2 days (AM data ⇒ shipped the next day) ■ 2 layers ⇒ Shortest 2 days (8 AM data ⇒ shipped the next day) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Flexible circuit board

Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

  • Other electronic parts
  • others
  • Processing Contract

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Rigid-flexible substrate

Rigid-flexible substrate

A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.

We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing

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Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.

We would like to introduce our achievements in circuit board manufacturing. We produced an ultra-long multilayer LCP board with a product size of 1300mm. The features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible board made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Process: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Board size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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4-layer blind via flexible circuit board

4-layer blind via flexible circuit board

Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.

The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials

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[Design and Production Example] Coil_FPC for Motor Field Windings

[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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Flexible Printed Circuit (FPC) "Transparent FPC"

Flexible Printed Circuit (FPC) "Transparent FPC"

Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!

"Transparent FPC" is a flexible printed circuit board (FPC) that excels in transparency and heat resistance, using transparent polyimide film as its substrate. We have worked on developing an FPC that achieves both high heat resistance and transparency by adopting a highly heat-resistant transparent polyimide film, thereby solving the issues of warping and dimensional changes caused by heat during reflow. As a result, it can be applied to various fields such as wearable devices and medical equipment, which prioritize design. [Features] - Uses highly heat-resistant transparent polyimide film - Can utilize the existing design rules of conventional FPCs - Proposes new wiring styles in fields such as medical, lighting, and industrial equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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